Hard alloy materials for electronic progressive dies
A reasonable process formula has been designed for high-speed stamping of electronic components such as SPCC, iron strip, copper strip, stainless steel, etc., in collaboration with market users, with the goal of improving wear resistance. During stamping processing, the wear of parts is greatly delayed, which can extend the service life of the mold.
| series | brand | granularity | Cobalt content (%) | Density (g/cm3) | hardness | Bending strength (Mpa) |
| Anti peeling series | CF09U | 0.4 | 9 | 14.55 | 93.5 | ≥4000 |
| CF12F | 0.4-0.6 | 12 | 14.12 | 92.5 | ≥4300 | |
| CF10F | 0.6-0.8 | 10 | 14.60 | 92.3 | ≥3800 | |
| VG12F | 0.6-0.8 | 12 | 14.13 | 91.3 | ≥3900 | |
| VG20F | 0.8 | 15 | 13.95 | 90.2 | ≥4000 |