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Hard alloy materials for electronic progressive dies

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Kunshan Shengyufeng New Material Technology Co., Ltd

Contact:Mr. Yang

Mobile:+86 17712471756

Mobile:+86 13584960756

Phone:0512-50881555

Email:coolk@syfcarbide.com

Website:www.southvietnamtravel.com

Address:1911 Shuixiu Road, Kunshan City, Jiangsu Province, China

Hard alloy materials for electronic progressive dies

A reasonable process formula has been designed for high-speed stamping of electronic components such as SPCC, iron strip, copper strip, stainless steel, etc., in collaboration with market users, with the goal of improving wear resistance. During stamping processing, the wear of parts is greatly delayed, which can extend the service life of the mold.

seriesbrandgranularityCobalt content (%)Density (g/cm3)hardnessBending strength (Mpa)
Anti peeling seriesCF09U0.4914.5593.5≥4000
CF12F0.4-0.61214.1292.5≥4300
CF10F0.6-0.81014.6092.3≥3800
VG12F0.6-0.81214.1391.3≥3900
VG20F0.81513.9590.2≥4000